NPod-Cold Plate Liquid Cooling for AI Servers

NPOD provides advanced cold plate cooling technology specially designed for high-power computing environments. Thanks to the removal of heat from critical components, our cold plate cooling solutions help organizations achieve increased efficiency, rack density, and performance of their IT infrastructure.

Best for: High-Performance Computing, Artificial Intelligence, Machine Learning, GPU Servers, and Energy Storage.

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Why Choose Liquid Cooling?

In contrast to air cooling technologies, cold plate cooling system remove heat directly from computing hardware, providing improved efficiency and reducing energy consumption. This technology allows one to maintain optimal temperature during the most intense workloads. Some benefits that your organization can enjoy from adopting liquid cooling for AI server include:

Thermal performance improvement
Server density increase
Lower energy consumption for cooling purposes
Increased hardware reliability

Liquid cooling is recommended for server in the 250-400W range and become essential for deployment exceeding 400W.

Smart CDUs for High Density Liquid Cooling Applications

Standard 19-inch rack CDU design for seamless liquid cooling for data center deployment.
Capable of delivering up to 50kW capacity within a space-efficient configuration.
Offers precise coolant temperature, pressure and flow control for optimum cooling performances.
Facilitates deployment of CPU GPU liquid cooling solution in AI, HPC and enterprise environments.
Easy monitoring and management functionality to ensure reliable operation and reduced maintenance work.
Fast connect technology allows for quick installations and effortless integration of liquid cooled servers

Advanced Manifolds & Connectors

Consistent coolant delivery is crucial to the success of liquid cooled infrastructures. Manifold systems from NPod ensure even distribution of coolant between racks and server while ensuring balanced flow rate and reliable operation.
Created for demanding GPU liquid cooling deployments, our manifold architecture provides scalability while minimizing maintenance requirements.
Rapid server replacement and maintenance with the help of quick disconnect connectors ensures minimal interruption to business activities.
For facilities implementing direct to chip cooling, reliable manifold and connector systems play a critical role in ensuring continuous cooling performance.

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Advanced HPC Liquid Cooling Solutions

Free Cooling Technology

NPOD free cooling solutions assist in minimizing reliance on traditional refrigeration systems, while still providing the necessary coolant at required temperatures for modern-day computing.
AI server liquid cooling systems can leverage free cooling technology to improve energy efficiency, reduce power consumption, and lower overall operating costs.
In combination with our cold plate cooling system architecture, free cooling chillers enable the creation of sustainable and cost-efficient cooling systems.
Employing environmentally-friendly refrigerants such as R407C or R134A for efficient operation.

Advanced Dry Cooling

Designed to support high density liquid cooling environments with a high-performance heat exchanger for efficient heat removal and dissipation.
Automated EC fan/VFD fan system adjusting itself according to current conditions.
Made from corrosion-resistant materials for increased longevity and durability.
Superior quality materials used in its construction.
Able to utilize either water or water/glycol solution depending on environment.
Evaporative pre-cooler is an optional additional module for increased performance under high temperatures.